Solar photovoltaic (PV) generation has seen significant growth in 2021, with an increase of around 22% and exceeding 1000 TWh. However, this has also led to reliability and durability issues, particularly potential induced degradation (PID), which can reduce module output by up to 30%. This study uses cell- and module-level analysis to investigate the impact of superstrate, encapsulant, and substrate on PID.The influence of different substrates and encapsulants is studied using one-cell modules, showing that substrates with poor water-blocking properties can worsen PID, and encapsulants with lower volumetric resistance can conduct easily under damp conditions, enabling PID mechanisms (results show maximum degradation of 9%). Applying an anti-soiling coating on the front glass (superstrate) reduces PID by nearly 53%. Typical superstrates have sodium which accelerates the PID process, and therefore, using such coatings can lessen the PID problem. At the module level, the study examines the influence of weakened interface adhesion strengths in traditional Glass-Backsheet (GB) and emerging Glass-Glass (GG) (primarily bifacial modules) constructions. The findings show nearly 64% more power degradation in GG modules than in GB. Moreover, the current methods for detecting PID use new modules, which can give inaccurate information instead of DH-stressed modules for PID testing, as done in this work. A comprehensive PID susceptibility analysis for multiple fresh bifacial constructions shows significant degradation from 20 to 50% in various constructions. The presence of glass as the substrate exacerbates the PID problem due to more ionic activity available from the two glass sides. Recovery experiments are also conducted to understand the extent of the PID issue. Overall, this study identifies, studies, and explains the impact of superstrate, substrate, and encapsulant on the underlying PID mechanisms. Various pre- and post-stress characterization tests, including light and dark current-voltage (I-V) tests, electroluminescence (EL) imaging, infrared (IR) imaging, and UV fluorescence (UVF) imaging, are used to evaluate the findings. This study is significant as it provides insights into the PID issues in solar PV systems, which can help improve their performance and reliability.

This is a two-part thesis.Part-I: This work investigated the long-term reliability of a statistically significant number of two different commercial module-level power electronics (MLPE) devices using two input power profiles at high temperatures to estimate their reliability and service life in field-use conditions. Microinverters underwent a period of 15,000 accelerated stress hours, whereas the power optimizers underwent a period of 6,400 accelerated stress hours. None of the MLPE devices failed during the accelerated test; however, the optimizers degraded by about 1% in output efficiency. Based on their accelerated stress temperatures, the estimated field equivalent service life approximated using the Arrhenius model ranges between 24-48 years for microinverters and 39-73 years for optimizers, with a reliability of 74% and a lower one-sided confidence level of 95%. Furthermore, using the Weibull distribution model, the reliability and service lifetimes of MLPE devices are statistically analyzed. MLPE lifetimes estimated using Weibull slope and shape parameters with a 95% lower one-sided confidence level indicate a similar, or possibly exceeding, the 25-year lifetime of the associated photovoltaic (PV) modules. Part–II:This study investigated the impact of the hotspot stress test on glass-backsheet and glass-glass modules. Before the hotspot testing, both modules were pre-stressed using 600 thermal cycles (TC600) to represent decades of field-exposed modules experiencing hotspot effects in field-use conditions. The glass-glass module reached a hotspot temperature of nearly 200°C, whereas the glass-backsheet module's maximum hotspot temperature was almost 150°C. After the hotspot experiment, electroluminescence imaging showed that most of the cells in the glass-glass module appeared to have experienced significant damage. In contrast, the stressed cells in the glass-backsheet module appeared to have experienced insignificant damage. After the sequential stress testing (hotspot testing after TC600), the glass-glass module degraded by nearly 8.3% in maximum power, whereas the glass-backsheet module experienced 1.3% degradation. This study also incorporated hotspot endurance in fresh (without being subjected to prior TC600) glass-glass and glass-backsheet modules. The test outcome demonstrated that both module types exhibited marginal maximum power loss.

A photovoltaic (PV) module is a series and parallel connection of multiple PV cells; defects in any cell can cause module power to drop. Similarly, a photovoltaic system is a series and parallel connection of multiple modules, and any low-performing module in the PV system can decrease the system output power. Defects in a solar cell include, but not limited to, the presence of cracks, potential induced degradation (PID), delamination, corrosion, and solder bond degradation. State-of-the-art characterization techniques to identify the defective cells in a module and defective module in a string are i) Current-voltage (IV) curve tracing, ii) Electroluminescence (EL) imaging, and iii) Infrared (IR) imaging. Shortcomings of these techniques include i) unsafe connection and disconnection need to be made with high voltage electrical cables, and ii) labor and time intensive disconnection of the photovoltaic strings from the system.This work presents a non-contact characterization technique to address the above two shortcomings. This technique uses a non-contact electrostatic voltmeter (ESV) along with a probe sensor to measure the surface potential of individual solar cells in a commercial module and the modules in a string in both off-grid and grid-connected systems. Unlike the EL approach, the ESV setup directly measures the surface potential by sensing the electric field lines that are present on the surface of the solar cell. The off-grid testing of ESV on individual cells and multicells in crystalline silicon (c-Si) modules and on individual cells in cadmium telluride (CdTe) modules and individual modules in a CdTe string showed less than 2% difference in open circuit voltage compared to the voltmeter values. In addition, surface potential mapping of the defective cracked cells in a multicell module using ESV identified the dark, grey, and bright areas of EL images precisely at the exact locations shown by the EL characterization. The on-grid testing of ESV measured the individual module voltages at maximum power point (Vmpp) and quantitatively identified the exact PID-affected module in the entire system. In addition, the poor-performing non-PID modules of a grid-connected PV system were also identified using the ESV technique.

This study introduces a new outdoor accelerated testing method called “Field Accelerated Stress Testing (FAST)” for photovoltaic (PV) modules performed at two different climatic sites in Arizona (hot-dry) and Florida (hot-humid). FAST is a combined accelerated test methodology that simultaneously accounts for all the field-specific stresses and accelerates only key stresses, such as temperature, to forecast the failure modes by 2- 7 times in advance depending on the activation energy of the degradation mechanism (i.e., 10th year reliability issues can potentially be predicted in the 2nd year itself for an acceleration factor of 5). In this outdoor combined accelerated stress study, the temperatures of test modules were increased (by 16-19℃ compared to control modules) using thermal insulations on the back of the modules. All other conditions (ambient temperature, humidity, natural sunlight, wind speed, wind direction, and tilt angle) were left constant for both test modules (with back thermal insulation) and control modules (without thermal insulation). In this study, a total of sixteen 4-cell modules with two different construction types (glass/glass [GG] and glass/backsheet [GB]) and two different encapsulant types (ethylene vinyl acetate [EVA] and polyolefin elastomer [POE]), were investigated at both sites with eight modules at each site (four insulated and four non-insulated modules at each site). All the modules were extensively characterized before installation in the field and after field exposure over two years. The methods used for characterizing the devices included I-V (current-voltage curves), EL (electroluminescence), UVF (ultraviolet fluorescence), and reflectance. The key findings of this study are: i) the GG modules tend to operate at a higher temperature (1-3℃) than the GB modules at both sites of Arizona and Florida (a lower lifetime is expected for GG modules compared to GB modules); ii) the GG modules tend to experience a higher level of encapsulant discoloration and grid finger degradation than the GB modules at both sites (a higher level of the degradation rate is expected in GG modules compared to GB modules); and, iii) the EVA-based modules tend to have a higher level of discoloration and finger degradation compared to the POE-based modules at both sites.

The primary goal of this thesis is to evaluate the influence of ethyl vinyl acetate (EVA) and polyolefin elastomer (POE) encapsulant types on the glass-glass (GG) photovoltaic (PV) module reliability. The influence of these two encapsulant types on the reliability of GG modules was compared with baseline glass-polymer backsheet (GB) modules for a benchmarking purpose. Three sets of modules, with four modules in each set, were constructed with two substrates types i.e. glass-glass (GG) and glass- polymer backsheet (GB); and 2 encapsulants types i.e. ethyl vinyl acetate (EVA) and polyolefin elastomer (POE). Each module set was subjected to the following accelerated tests as specified in the International Electrotechnical Commission (IEC) standard and Qualification Plus protocol of NREL: Ultraviolet (UV) 250 kWh/m2; Thermal Cycling (TC) 200 cycles; Damp Heat (DH) 1250 hours. To identify the failure modes and reliability issues of the stressed modules, several module-level non-destructive characterizations were carried out and they include colorimetry, UV-Vis-NIR spectral reflectance, ultraviolet fluorescence (UVF) imaging, electroluminescence (EL) imaging, and infrared (IR) imaging. The above-mentioned characterizations were performed on the front side of the modules both before the stress tests (i.e. pre-stress) and after the stress tests (i.e. post-stress). The UV-250 extended stress results indicated slight changes in the reflectance on the non-cell area of EVA modules probably due to minor adhesion loss at the cell and module edges. From the DH-1250 extended stress tests, significant changes, in both encapsulant types modules, were observed in reflectance and UVF images indicating early stages of delamination. In the case of the TC-200 stress test, practically no changes were observed in all sets of modules. From the above short-term stress tests, it appears although not conclusive at this stage of the analysis, delamination seems to be the only failure mode that could possibly be affecting the module performance, as observed from UV and DH extended stress tests. All these stress tests need to be continued to identify the wear-out failure modes and their impacts on the performance parameters of PV modules.

An ongoing effort in the photovoltaic (PV) industry is to reduce the major manufacturing cost components of solar cells, the great majority of which are based on crystalline silicon (c-Si). This includes the substitution of screenprinted silver (Ag) cell contacts with alternative copper (Cu)-based contacts, usually applied with plating. Plated Cu contact schemes have been under study for many years with only minor traction in industrial production. One of the more commonly-cited barriers to the adoption of Cu-based contacts for photovoltaics is long-term reliability, as Cu is a significant contaminant in c-Si, forming precipitates that degrade performance via degradation of diode character and reduction of minority carrier lifetime. Cu contamination from contacts might cause degradation during field deployment if Cu is able to ingress into c-Si. Furthermore, Cu contamination is also known to cause a form of light-induced degradation (LID) which further degrades carrier lifetime when cells are exposed to light.

Prior literature on Cu-contact reliability tended to focus on accelerated testing at the cell and wafer level that may not be entirely replicative of real-world environmental stresses in PV modules. This thesis is aimed at advancing the understanding of Cu-contact reliability from the perspective of quasi-commercial modules under more realistic stresses. In this thesis, c-Si solar cells with Cu-plated contacts are fabricated, made into PV modules, and subjected to environmental stress in an attempt to induce hypothesized failure modes and understand any new vulnerabilities that Cu contacts might introduce. In particular, damp heat stress is applied to conventional, p-type c-Si modules and high efficiency, n-type c-Si heterojunction modules. I present evidence of Cu-induced diode degradation that also depends on PV module materials, as well as degradation unrelated to Cu, and in either case suggest engineering solutions to the observed degradation. In a forensic search for degradation mechanisms, I present novel evidence of Cu outdiffusion from contact layers and encapsulant-driven contact corrosion as potential key factors. Finally, outdoor exposures to light uncover peculiarities in Cu-plated samples, but do not point to especially serious vulnerabilities.

In the current photovoltaic (PV) industry, the O&M (operations and maintenance) personnel in the field primarily utilize three approaches to identify the underperforming or defective modules in a string: i) EL (electroluminescence) imaging of all the modules in the string; ii) IR (infrared) thermal imaging of all the modules in the string; and, iii) current-voltage (I-V) curve tracing of all the modules in the string. In the first and second approaches, the EL images are used to detect the modules with broken cells, and the IR images are used to detect the modules with hotspot cells, respectively. These two methods may identify the modules with defective cells only semi-qualitatively, but not accurately and quantitatively. The third method, I-V curve tracing, is a quantitative method to identify the underperforming modules in a string, but it is an extremely time consuming, labor-intensive, and highly ambient conditions dependent method. Since the I-V curves of individual modules in a string are obtained by disconnecting them individually at different irradiance levels, module operating temperatures, angle of incidences (AOI) and air-masses/spectra, all these measured curves are required to be translated to a single reporting condition (SRC) of a single irradiance, single temperature, single AOI and single spectrum. These translations are not only time consuming but are also prone to inaccuracy due to inherent issues in the translation models. Therefore, the current challenges in using the traditional I-V tracers are related to: i) obtaining I-V curves simultaneously of all the modules and substrings in a string at a single irradiance, operating temperature, irradiance spectrum and angle of incidence due to changing weather parameters and sun positions during the measurements, ii) safety of field personnel when disconnecting and reconnecting of cables in high voltage systems (especially field aged connectors), and iii) enormous time and hardship for the test personnel in harsh outdoor climatic conditions. In this thesis work, a non-contact I-V (NCIV) curve tracing tool has been integrated and implemented to address the above mentioned three challenges of the traditional I-V tracers.

This work compares I-V curves obtained using a traditional I-V curve tracer with the I-V curves obtained using a NCIV curve tracer for the string, substring and individual modules of crystalline silicon (c-Si) and cadmium telluride (CdTe) technologies. The NCIV curve tracer equipment used in this study was integrated using three commercially available components: non-contact voltmeters (NCV) with voltage probes to measure the voltages of substrings/modules in a string, a hall sensor to measure the string current and a DAS (data acquisition system) for simultaneous collection of the voltage data obtained from the NCVs and the current data obtained from the hall sensor. This study demonstrates the concept and accuracy of the NCIV curve tracer by comparing the I-V curves obtained using a traditional capacitor-based tracer and the NCIV curve tracer in a three-module string of c-Si modules and of CdTe modules under natural sunlight with uniform light conditions on all the modules in the string and with partially shading one or more of the modules in the string to simulate and quantitatively detect the underperforming module(s) in a string.

The main objective of this research is to develop reliability assessment methodologies to quantify the effect of various environmental factors on photovoltaic (PV) module performance degradation. The manufacturers of these photovoltaic modules typically provide a warranty level of about 25 years for 20% power degradation from the initial specified power rating. To quantify the reliability of such PV modules, the Accelerated Life Testing (ALT) plays an important role. But there are several obstacles that needs to be tackled to conduct such experiments, since there has not been enough historical field data available. Even if some time-series performance data of maximum output power (Pmax) is available, it may not be useful to develop failure/degradation mode-specific accelerated tests. This is because, to study the specific failure modes, it is essential to use failure mode-specific performance variable (like short circuit current, open circuit voltage or fill factor) that is directly affected by the failure mode, instead of overall power which would be affected by one or more of the performance variables. Hence, to address several of the above-mentioned issues, this research is divided into three phases. The first phase deals with developing models to study climate specific failure modes using failure mode specific parameters instead of power degradation. The limited field data collected after a long time (say 18-21 years), is utilized to model the degradation rate and the developed model is then calibrated to account for several unknown environmental effects using the available qualification testing data. The second phase discusses the cumulative damage modeling method to quantify the effects of various environmental variables on the overall power production of the photovoltaic module. Mainly, this cumulative degradation modeling approach is used to model the power degradation path and quantify the effects of high frequency multiple environmental input data (like temperature, humidity measured every minute or hour) with very sparse response data (power measurements taken quarterly or annually). The third phase deals with optimal planning and inference framework using Iterative-Accelerated Life Testing (I-ALT) methodology. All the proposed methodologies are demonstrated and validated using appropriate case studies.

The operating temperature of photovoltaic (PV) modules has a strong impact on the expected performance of said modules in photovoltaic arrays. As the install capacity of PV arrays grows throughout the world, improved accuracy in modeling of the expected module temperature, particularly at finer time scales, requires improvements in the existing photovoltaic temperature models. This thesis work details the investigation, motivation, development, validation, and implementation of a transient photovoltaic module temperature model based on a weighted moving-average of steady-state temperature predictions.

This thesis work first details the literature review of steady-state and transient models that are commonly used by PV investigators in performance modeling. Attempts to develop models capable of accounting for the inherent transient thermal behavior of PV modules are shown to improve on the accuracy of the steady-state models while also significantly increasing the computational complexity and the number of input parameters needed to perform the model calculations.

The transient thermal model development presented in this thesis begins with an investigation of module thermal behavior performed through finite-element analysis (FEA) in a computer-aided design (CAD) software package. This FEA was used to discover trends in transient thermal behavior for a representative PV module in a timely manner. The FEA simulations were based on heat transfer principles and were validated against steady-state temperature model predictions. The dynamic thermal behavior of PV modules was determined to be exponential, with the shape of the exponential being dependent on the wind speed and mass per unit area of the module.

The results and subsequent discussion provided in this thesis link the thermal behavior observed in the FEA simulations to existing steady-state temperature models in order to create an exponential weighting function. This function can perform a weighted average of steady-state temperature predictions within 20 minutes of the time in question to generate a module temperature prediction that accounts for the inherent thermal mass of the module while requiring only simple input parameters. Validation of the modeling method presented here shows performance modeling accuracy improvement of 0.58%, or 1.45°C, over performance models relying on steady-state models at narrow data intervals.

The popularity of solar photovoltaic (PV) energy is growing across the globe with more than 500 GW installed in 2018 with a capacity of 640 GW in 2019. Improved PV module reliability minimizes the levelized cost of energy. Studying and accelerating encapsulant browning and solder bond degradation—two of the most commonly observed degradation modes in the field—in a lab requires replicating the stress conditions that induce the same field degradation modes in a controlled accelerated environment to reduce testing time.

Accelerated testing is vital in learning about the reliability of solar PV modules. The unique streamlined approach taken saves time and resources with a statistically significant number of samples being tested in one chamber under multiple experimental stress conditions that closely mirror field conditions that induce encapsulant browning and solder bond degradation. With short circuit current (Isc) and series resistance (Rs) degradation data sets at multiple temperatures, the activation energies (Ea) for encapsulant browning and solder bond degradation was calculated.

Regular degradation was replaced by the wear-out stages of encapsulant browning and solder bond degradation by subjecting two types of field-aged modules to further accelerated testing. For browning, the Ea calculated through the Arrhenius model was 0.37 ± 0.17 eV and 0.71 ± 0.07 eV. For solder bond degradation, the Arrhenius model was used to calculate an Ea of 0.12 ± 0.05 eV for solder with 2wt% Ag and 0.35 ± 0.04 eV for Sn60Pb40 solder.

To study the effect of types of encapsulant, backsheet, and solder on encapsulant browning and solder bond degradation, 9-cut-cell samples maximizing available data points while minimizing resources underwent accelerated tests described for modules. A ring-like browning feature was observed in samples with UV pass EVA above and UV cut EVA below the cells. The backsheet permeability influences the extent of oxygen photo-bleaching. In samples with solder bond degradation, increased bright spots and cell darkening resulted in increased Rs. Combining image processing with fluorescence imaging and electroluminescence imaging would yield great insight into the two degradation modes.