The performance of kilometer-scale electron accelerators, which are used for high energy physics and next-generation light sources as well as meter-scale ultra-fast electron diffraction setups is limited by the brightness of electron sources. A potential emerging candidate for such applications is the family of alkali and bi-alkali antimonides. Much of the physics of photoemission from such semiconductor photocathodes is not fully understood even today, which poses a hindrance to the complete exploration and optimization of their photoemission properties. This thesis presents the theoretical and experimental measurements which lead to advances in the understanding of the photoemission process and properties of cesium-antimonide photocathodes. First, the growth of high quantum efficiency (QE), atomically smooth and chemically homogeneous Cs$_3$Sb cathodes on lattice-matched strontium titanate substrates (STO) is demonstrated. The roughness-induced mean transverse energies (MTE) simulations indicate that the contribution to MTE from nanoscale surface roughness of Cs$_3$Sb cathodes grown on STO is inconsequential over typically used field gradients in photoinjectors. Second, the formulation of a new approach to model photoemission from cathodes with disordered surfaces is demonstrated. The model is used to explain near-threshold photoemission from thin film Cs$_3$Sb cathodes. This model suggests that the MTE values may get limited to higher values due to the defect density of states near the valence band maximum. Third, the detailed measurements of MTE and kinetic energy distribution spectra along with QE from Cs$_3$Sb cathodes using the photoemission electron microscope are presented. These measurements indicate that Cs$_3$Sb cathodes have a work function in the range of 1.5-1.6 eV. When photoemitting near this work function energy, the MTE nearly converges to the thermal limit of 26 meV. However, the QE is extremely low, of the order of 10$^{-7}$, which limits the operation of these photocathodes for high current applications. Lastly, the growth of Cs$_3$Sb cathodes using the ion beam assisted molecular beam deposition (IBA-MBE) technique is demonstrated. This technique has the potential to grow epitaxial Cs$_3$Sb cathodes in a more reproducible, easier fashion. Structural characterization of such cathodes via tools such as reflection high energy electron diffraction (RHEED) and x-ray diffraction (XRD) will be necessary to investigate the role of the IBA-MBE technique in facilitating the epitaxial, ordered growth of alkali-antimonides.

Wide Bandgap (WBG) semiconductor materials are shaping day-to-day technologyby introducing powerful and more energy responsible devices. These materials have opened the door for building basic semiconductor devices which are superior in terms of handling high voltages, high currents, power, and temperature which is not possible using conventional silicon technology. As the research continues in the field of WBG based devices, there is a potential chance that the power electronics industry can save billions of dollars deploying energy-efficient circuits in high power conversion electronics. Diamond, silicon carbide and gallium nitride are the top three contenders among which diamond can significantly outmatch others in a variety of properties. However, diamond technology is still in its early phase of development and there are challenges involved in many aspects of processing a successful integrated circuit. The work done in this research addresses three major aspects of problems related to diamond technology. In the first part, the applicability of compact modeling and Technology Computer-Aided Design (TCAD) modeling technique for diamond Schottky p-i-n diodes has been demonstrated. The compact model accurately predicts AC, DC and nonlinear behavior of the diode required for fast circuit simulation. Secondly, achieving low resistance ohmic contact onto n-type diamond is one of the major issues that is still an open research problem as it determines the performance of high-power RF circuits and switching losses in power converters circuits. So, another portion of this thesis demonstrates the achievement of very low resistance ohmic contact (~ 10-4 Ω⋅cm2) onto n-type diamond using nano crystalline carbon interface layer. Using the developed TCAD and compact models for low resistance contacts, circuit level predictions show improvements in RF performance. Lastly, an initial study of breakdown characteristics of diamond and cubic boron nitride heterostructure is presented. This study serves as a first step for making future transistors using diamond and cubic boron nitride – a very less explored material system in literature yet promising for extreme circuit applications involving high power and temperature.

Gallium Nitride (GaN) is uniquely suited for Radio Frequency (RF) and power electronic applications due to its intrinsically high saturation velocity and high mobility compared to Silicon and Silicon Carbide (SiC). High Electron Mobility Transistors (HEMTs) have remained the primary topology for GaN transistors in RF applications. However, GaN HEMTs suffer from a variety of issues such as current crowding, lack of enhancement mode (E-Mode) operation and non-linearity. These drawbacks slow the widespread adoption of GaN devices for ultra-low voltage (ULV) applications such as voltage regulators, automotive and computing applications. E-mode operation is especially desired in low-voltage high frequency switching applications. In this context, Fin Field Effect Transistors (FinFETs) offer an alternative topology for ULV applications as opposed to conventional HEMTs. Recent advances in material processing, high aspect ratio epitaxial growth and etching methods has led to an increased interest in 3D nanostructures such as Nano-FinFETs and Nanowire FETs. A typical 3D nano-FinFET is the AlGaN/GaN Metal Insulator Semiconductor (MIS) FET wherein a layer of Al2O3 surrounds the AlGaN/GaN fin. The presence of the side gates leads to additional lateral confinement of the 2D Electron Gas (2DEG). Theoretical calculations of transport properties in confined systems such as AlGaN/GaN Finfets are scarce compared to those of their planar HEMT counterparts. A novel simulator is presented in this dissertation, which employs self-consistent solution of the coupled 1D Boltzmann – 2D Schrödinger – 3D Poisson problem, to yield the channel electrostatics and the low electric field transport characteristics of AlGaN/GaN MIS FinFETs. The low field electron mobility is determined by solving the Boltzmann transport equation in the Quasi-1D region using 1D Ensemble Monte Carlo method. Three electron-phonon scattering mechanisms (acoustic, piezoelectric and polar optical phonon scattering) and interface roughness scattering at the AlGaN/GaN interface are considered in this theoretical model. Simulated low-field electron mobility and its temperature dependence are in agreement with experimental data reported in the literature. A quasi-1D version of alloy clustering model is derived and implemented and the limiting effect of alloy clustering on the low-field electron mobility is investigated for the first time for MIS FinFET device structures.

This paper begins with an introduction to the topics relevant to the research presented. Properties of diamond, diamond’s ability to be used in power electronics compared to other semiconducting materials, and a brief overview of field effect transistors are among the topics discussed. The remainder of the paper centers around research that has been conducted on seven diamond samples. Interface characterization was performed on two diamond samples, one with a high boron incorporation epitaxial layer and another with a low boron incorporation epitaxial layer. UPS He I analysis and UPS He II analysis were used to construct band alignments for the two samples, which revealed no significant differences between their measured properties. A Python program designed to optimize XPS loss peak and UPS He II graphical data analysis is also discussed in detail. Next, Hall effect measurements are examined. Hall effect measurements were carried out on seven diamond samples, two of which have high boron incorporation epitaxial layers, two of which have low boron incorporation epitaxial layers, one of which has a moderate boron incorporation epitaxial layer, and two of which have a phosphorus-doped epitaxial layer. Hall measurements of the boron-doped samples revealed no significant differences in measured parameters amongst the samples with varying boron incorporation epitaxial layers, with the exception of an expected difference in measured carrier concentration proportional to the amount of dopant incorporation in the layers. Some samples with boron-doped epitaxial layers produced measurements indicating n-type charge carriers, which is unexpected given the p-type charge carriers within these samples. The phosphorus-doped samples were unable to be measured due to overly high resistance following an oxygen termination step, and this effect was functionally reversed following hydrogen termination of the samples. It is hypothesized that Fermi pinning is responsible for this effect. The paper concludes with a summary of data discussed in previous sections and a suggested direction for future research on this topic.

Wide bandgap semiconductors, also known as WBG semiconductors are materials which have larger bandgaps than conventional semiconductors such as Si or GaAs. They permit devices to operate at much higher voltages, frequencies and temperatures. They are the key material used to make LEDs, lasers, radio frequency applications, military applications, and power electronics. Their intrinsic qualities make them promising for next-generation devices for general semiconductor use. Their ability to handle higher power density is particularly attractive for attempts to sustain Moore's law, as conventional technologies appear to be reaching a bottleneck. Apart from WBG materials, ultra-wide bandgap (UWBG) materials, such as Ga2O3, AlN, diamond, or BN, are also attractive since they have even more extreme properties. Although this field is relatively new, which still remains a lot of effort to study and investigate, people can still expect that these materials could be the main characters for more advanced applications in the near future. In the dissertation, three topics with power devices made by WBG or UWBG semiconductors were introduced. In chapter 1, a generally background knowledge introduction is given. This helps the reader to learn current research focuses. In chapter 2, a comprehensive study of temperature-dependent characteristics of Ga2O3 SBDs with highly-doped substrate is demonstrated. A modified thermionic emission model over an inhomogeneous barrier with a voltage-dependent barrier height is investigated. Besides, the mechanism of surface leakage current is also discussed. These results are beneficial for future developments of low-loss β-Ga2O3 electronics and optoelectronics. In chapter 3, vertical GaN Schottky barrier diodes (SBDs) with floating metal rings (FMRs) as edge termination structures on bulk GaN substrates was introduced. This work represents a useful reference for the FMR termination design for GaN power devices. In chapter 4, AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MISHEMTs) fabricated on Si substrates with a 10 nm boron nitride (BN) layer as gate dielectric was demonstrated. The material characterization was investigated by X-ray photoelectric spectroscopy (XPS) and UV photoelectron spectroscopy (UPS). And the gate leakage current mechanisms were also investigated by temperature-dependent current-voltage measurements. Although still in its infancy, past and projected future progress of electronic designs will ultimately achieve this very goal that WBG and UWBG semiconductors will be indispensable for today and future’s science, technologies and society.

In this dissertation, far UV spectroscopy is applied to investigate the optical properties of dielectric thin films grown by atomic layer deposition. The far UV (120 – 200 nm) reflectance for several dielectric oxides and fluorides, including AlF3, Al2O3, Ga2O3, HfO2, and SiO2, was measured at variable angles and thicknesses. Multiple optical calculation methods were developed for the accurate determination of the optical constants from the reflectance. The deduced optical constants were used for optical designs, such as high-reflectivity coatings, and Fabry-Perot bandpass interference filters. Three filters were designed for use at 157 nm, 212 nm, and 248 nm wavelengths, based on multilayer structures consisting of SiO2, Al2O3, HfO2, and AlF3. A thorough error analysis was made to quantify the non-idealities of the optical performance for the designed filters. Far UV spectroscopy was also applied to analyze material mixtures, such as AlF3/Al and h-BN/c-BN mixtures. Using far UV spectroscopy, different phases in the composite can be distinguished, and the volume concentration of each constituent can be determined. A middle UV reflective coating based on A2O3 and AlF3 was fabricated and characterized. The reflective coating has a smooth surface (?? < 1 nm), and a peak reflectance of 25 – 30 % at a wavelength of 196 nm. The peak reflectance deviated from the design, and an analysis of the AlF3 layer prepared by plasma-enhanced atomic layer deposition (PEALD) indicated the presence of Al-rich clusters, which were associated with the UV absorption. Complementary techniques, such as spectroscopic ellipsometry, and X-ray photoelectron spectroscopy, were used to verify the results from far UV spectroscopy. In conclusion, this Dissertation demonstrated the use of in-situ far UV spectroscopy to investigate the optical properties of thin films at short wavelengths. This work extends the application of far UV spectroscopy to ultrawide bandgap semiconductors and insulators. This work supports a path forward for far UV optical filters and devices. Various errors have been discussed with solutions proposed for future research of methods and materials for UV optics.

Wide bandgap semiconductors are of much current interest due to their superior electrical properties. This dissertation describes electron microscopy characterization of GaN-on-GaN structures for high-power vertical device applications. Unintentionally-doped (UID) GaN layers grown homoepitaxially via metal-organic chemical vapor deposition on freestanding GaN substrates, were subjected to dry etching, and layers of UID-GaN/p-GaN were over-grown. The as-grown and regrown heterostructures were examined in cross-section using transmission electron microscopy (TEM). Two different etching treatments, fast-etch-only and multiple etches with decreasing power, were employed. The fast-etch-only devices showed GaN-on-GaN interface at etched location, and low device breakdown voltages were measured (~ 45-95V). In comparison, no interfaces were visible after multiple etching steps, and the corresponding breakdown voltages were much higher (~1200-1270V). These results emphasized importance of optimizing surface etching techniques for avoiding degraded device performance. The morphology of GaN-on-GaN devices after reverse-bias electrical stressing to breakdown was investigated. All failed devices had irreversible structural damage, showing large surface craters (~15-35 microns deep) with lengthy surface cracks. Cross-sectional TEM of failed devices showed high densities of threading dislocations (TDs) around the cracks and near crater surfaces. Progressive ion-milling across damaged devices revealed high densities of TDs and the presence of voids beneath cracks: these features were not observed in unstressed devices. The morphology of GaN substrates grown by hydride vapor-phase epitaxy (HVPE) and by ammonothermal methods were correlated with reverse-bias results. HVPE substrates showed arrays of surface features when observed by X-ray topography (XRT). All fabricated devices that overlapped with these features had typical reverse-bias voltages less than 100V at a leakage current limit of 10-6 A. In contrast, devices not overlapping with such features reached voltages greater than 300V. After etching, HVPE substrate surfaces showed defect clusters and macro-pits, whereas XRT images of ammonothermal substrate revealed no visible features. However, some devices fabricated on ammonothermal substrate failed at low voltages. Devices on HVPE and ammonothermal substrates with low breakdown voltages showed crater-like surface damage and revealed TDs (~25µm deep) and voids; such features were not observed in devices reaching higher voltages. These results should assist in developing protocols to fabricate reliable high-voltage devices.

In this project we are analyzing the diamond-titanium interface as it applies to diamond-based diode devices, including alpha particle, proton, and neutron detectors. This is done through the fabrication of an O-terminated B-doped diamond sample with a 20 Å Ti / 10 Å Pt overlayer which was then annealed and examined via X-ray photoelectron spectroscopy (XPS). It was discovered that after annealing the sample at temperatures ranging from 400 C - 900 C that TiC was not formed at any point during this experiment. Possible reasons for this include a lack of sufficient titanium in order to form TiC and over oxygenating the diamond surface before the metal was deposited.

In this dissertation I studied the anomalous Hall effect in MgO/Permalloy/Nonmagnetic Metal(NM) based structure, spin polarized current in YIG/Pt based thin films and the origin of the perpendicular magnetic anisotropy(PMA) in the Ru/Co/Ru based structures.

The anomalous Hall effect is the observation of a nonzero voltage difference across a magnetic material transverse to the current that flows through the material and the external magnetic field. Unlike the ordinary Hall effect which is observed in nonmagnetic metals, the anomalous Hall effect is only observed in magnetic materials and is orders of magnitude larger than the ordinary Hall effect. Unlike quantum anomalous Hall effect which only works in low temperature and extremely large magnetic field, anomalous Hall effect can be measured at room temperature under a relatively small magnetic field. This allows the anomalous Hall effect to have great potential applications in spintronics and be a good characterization tool for ferromagnetic materials especially materials that have perpendicular magnetic anisotropy(PMA).

In my research, it is observed that a polarity change of the Hall resistance in the MgO/Permalloy/NM structure can be obtained when certain nonmagnetic metal is used as the capping layer while no polarity change is observed when some other metal is used as the capping layer. This allows us to tune the polarity of the anomalous Hall effect by changing the thickness of a component of the structure. My conclusion is that an intrinsic mechanism from Berry curvature plays an important role in the sign of anomalous Hall resistivity in the MgO/Py/HM structures. Surface and interfacial scattering also make substantial contribution to the measured Hall resistivity.

Spin polarization(P) is one of the key concepts in spintronics and is defined as the difference in the spin up and spin down electron population near the Fermi level of a conductor. It has great applications in the spintronics field such as the creation of spin transfer torques, magnetic tunnel junction(MTJ), spintronic logic devices.

In my research, spin polarization is measured on platinum layers grown on a YIG layer. Platinum is a nonmagnetic metal with strong spin orbit coupling which intrinsically has zero spin polarization. Nontrivial spin polarization measured by ARS is observed in the Pt layer when it is grown on YIG ferromagnetic insulator. This result is contrary to the zero spin polarization in the Pt layer when it is grown directly on SiO2 substrate. Magnetic proximity effect and spin current pumping from YIG into Pt is proposed as the reason of the nontrivial spin polarization induced in Pt. An even higher spin polarization in the Pt layer is observed when an ultrathin NiO layer or Cu layer is inserted between Pt and YIG which blocks the proximity effect. The spin polarization in the NiO inserted sample shows temperature dependence. This demonstrates that the spin current transmission is further enhanced in ultrathin NiO layers through magnon and spin fluctuations.

Perpendicular Magnetic Anisotropy(PMA) has important applications in spintronics and magnetic storage. In the last chapter, I study the origin of PMA in one of the structures that shows PMA: Ru/Co/Ru. By measuring the ARS curve while changing the magnetic field orientation, the origin of the PMA in this structure is determined to be the strain induced by lattice mismatch.