This PhD thesis consists of three main themes. The first part focusses on modeling of Silver (Ag)-Chalcogenide glass based resistive memory devices known as the Programmable Metallization Cell (PMC). The proposed models are examined with the Technology Computer Aided Design (TCAD) simulations. In order to find a relationship between electrochemistry and carrier-trap statistics in chalcogenide glass films, an analytical mapping for electron trapping is derived. Then, a physical-based model is proposed in order to explain the dynamic behavior of the photodoping mechanism in lateral PMCs. At the end, in order to extract the time constant of ChG materials, a method which enables us to determine the carriers’ mobility with and without the UV light exposure is proposed. In order to validate these models, the results of TCAD simulations using Silvaco ATLAS are also presented in the study, which show good agreement.

In the second theme of this dissertation, a new model is presented to predict single event transients in 1T-1R memory arrays as an inverter, where the PMC is modeled as a constant resistance while the OFF transistor is model as a diode in parallel to a capacitance. The model divides the output voltage transient response of an inverter into three time segments, where an ionizing particle striking through the drain–body junction of the OFF-state NMOS is represented as a photocurrent pulse. If this current source is large enough, the output voltage can drop to a negative voltage. In this model, the OFF-state NMOS is represented as the parallel combination of an ideal diode and the intrinsic capacitance of the drain–body junction, while a resistance represents an ON-state NMOS. The proposed model is verified by 3-D TCAD mixed-mode device simulations. In order to investigate the flexibility of the model, the effects of important parameters, such as ON-state PMOS resistance, doping concentration of p-region in the diode, and the photocurrent pulse are scrutinized.

The third theme of this dissertation develops various models together with TCAD simulations to model the behavior of different diamond-based devices, including PIN diodes and bipolar junction transistors (BJTs). Diamond is a very attractive material for contemporary power semiconductor devices because of its excellent material properties, such as high breakdown voltage and superior thermal conductivity compared to other materials. Collectively, this research project enhances the development of high power and high temperature electronics using diamond-based semiconductors. During the fabrication process of diamond-based devices, structural defects particularly threading dislocations (TDs), may affect the device electrical properties, and models were developed to account of such defects. Recognition of their behavior helps us understand and predict the performance of diamond-based devices. Here, the electrical conductance through TD sites is shown to be governed by the Poole-Frenkel emission (PFE) for the temperature (T) range of 323 K ˂ T ˂ 423 K. Analytical models were performed to fit with experimental data over the aforementioned temperature range. Next, the Silvaco Atlas tool, a drift-diffusion based TCAD commercial software, was used to model diamond-based BJTs. Here, some field plate methods are proposed in order to decrease the surface electric field. The models used in Atlas are modified to account for both hopping transport in the impurity bands associated with high activation energies for boron doped and phosphorus doped diamond.

Internet of Things (IoT) has become a popular topic in industry over the recent years, which describes an ecosystem of internet-connected devices or things that enrich the everyday life by improving our productivity and efficiency. The primary components of the IoT ecosystem are hardware, software and services. While the software and services of IoT system focus on data collection and processing to make decisions, the underlying hardware is responsible for sensing the information, preprocess and transmit it to the servers. Since the IoT ecosystem is still in infancy, there is a great need for rapid prototyping platforms that would help accelerate the hardware design process. However, depending on the target IoT application, different sensors are required to sense the signals such as heart-rate, temperature, pressure, acceleration, etc., and there is a great need for reconfigurable platforms that can prototype different sensor interfacing circuits.

This thesis primarily focuses on two important hardware aspects of an IoT system: (a) an FPAA based reconfigurable sensing front-end system and (b) an FPGA based reconfigurable processing system. To enable reconfiguration capability for any sensor type, Programmable ANalog Device Array (PANDA), a transistor-level analog reconfigurable platform is proposed. CAD tools required for implementation of front-end circuits on the platform are also developed. To demonstrate the capability of the platform on silicon, a small-scale array of 24×25 PANDA cells is fabricated in 65nm technology. Several analog circuit building blocks including amplifiers, bias circuits and filters are prototyped on the platform, which demonstrates the effectiveness of the platform for rapid prototyping IoT sensor interfaces.

IoT systems typically use machine learning algorithms that run on the servers to process the data in order to make decisions. Recently, embedded processors are being used to preprocess the data at the energy-constrained sensor node or at IoT gateway, which saves considerable energy for transmission and bandwidth. Using conventional CPU based systems for implementing the machine learning algorithms is not energy-efficient. Hence an FPGA based hardware accelerator is proposed and an optimization methodology is developed to maximize throughput of any convolutional neural network (CNN) based machine learning algorithm on a resource-constrained FPGA.

Improving energy efficiency has always been the prime objective of the custom and automated digital circuit design techniques. As a result, a multitude of methods to reduce power without sacrificing performance have been proposed. However, as the field of design automation has matured over the last few decades, there have been no new automated design techniques, that can provide considerable improvements in circuit power, leakage and area. Although emerging nano-devices are expected to replace the existing MOSFET devices, they are far from being as mature as semiconductor devices and their full potential and promises are many years away from being practical.

The research described in this dissertation consists of four main parts. First is a new circuit architecture of a differential threshold logic flipflop called PNAND. The PNAND gate is an edge-triggered multi-input sequential cell whose next state function is a threshold function of its inputs. Second a new approach, called hybridization, that replaces flipflops and parts of their logic cones with PNAND cells is described. The resulting \hybrid circuit, which consists of conventional logic cells and PNANDs, is shown to have significantly less power consumption, smaller area, less standby power and less power variation.

Third, a new architecture of a field programmable array, called field programmable threshold logic array (FPTLA), in which the standard lookup table (LUT) is replaced by a PNAND is described. The FPTLA is shown to have as much as 50% lower energy-delay product compared to conventional FPGA using well known FPGA modeling tool called VPR.

Fourth, a novel clock skewing technique that makes use of the completion detection feature of the differential mode flipflops is described. This clock skewing method improves the area and power of the ASIC circuits by increasing slack on timing paths. An additional advantage of this method is the elimination of hold time violation on given short paths.

Several circuit design methodologies such as retiming and asynchronous circuit design can use the proposed threshold logic gate effectively. Therefore, the use of threshold logic flipflops in conventional design methodologies opens new avenues of research towards more energy-efficient circuits.

This work focuses on the existence of multiple resistance states in a type of emerging non-volatile resistive memory device known commonly as Programmable Metallization Cell (PMC) or Conductive Bridge Random Access Memory (CBRAM), which can be important for applications such as multi-bit memory as well as non-volatile logic and neuromorphic computing. First, experimental data from small signal, quasi-static and pulsed mode electrical characterization of such devices are presented which clearly demonstrate the inherent multi-level resistance programmability property in CBRAM devices. A physics based analytical CBRAM compact model is then presented which simulates the ion-transport dynamics and filamentary growth mechanism that causes resistance change in such devices. Simulation results from the model are fitted to experimental dynamic resistance switching characteristics. The model designed using Verilog-a language is computation-efficient and can be integrated with industry standard circuit simulation tools for design and analysis of hybrid circuits involving both CMOS and CBRAM devices. Three main circuit applications for CBRAM devices are explored in this work. Firstly, the susceptibility of CBRAM memory arrays to single event induced upsets is analyzed via compact model simulation and experimental heavy ion testing data that show possibility of both high resistance to low resistance and low resistance to high resistance transitions due to ion strikes. Next, a non-volatile sense amplifier based flip-flop architecture is proposed which can help make leakage power consumption negligible by allowing complete shutdown of power supply while retaining its output data in CBRAM devices. Reliability and energy consumption of the flip-flop circuit for different CBRAM low resistance levels and supply voltage values are analyzed and compared to CMOS designs. Possible extension of this architecture for threshold logic function computation using the CBRAM devices as re-configurable resistive weights is also discussed. Lastly, Spike timing dependent plasticity (STDP) based gradual resistance change behavior in CBRAM device fabricated in back-end-of-line on a CMOS die containing integrate and fire CMOS neuron circuits is demonstrated for the first time which indicates the feasibility of using CBRAM devices as electronic synapses in spiking neural network hardware implementations for non-Boolean neuromorphic computing.

Soft magnetic materials have been studied extensively in the recent past due to their applications in micro-transformers, micro-inductors, spin dependent memories etc. The unique features of these materials are the high frequency operability and high magnetic anisotropy. High uniaxial anisotropy is one of the most important properties for these materials. There are many methods to achieve high anisotropy energy (Hk) which include sputtering with presence of magnetic field, exchange bias and oblique angle sputtering.

This research project focuses on analyzing different growth techniques of thin films of Cobalt, Zirconium Tantalum Boron (CZTB) and the quality of the films resulted. The measurements include magnetic moment measurements using a Vibrating Sample Magnetometer, electrical measurements using 4 point resistivity methods and structural characterization using Scanning Electron Microscopy. Subtle changes in the growth mechanism result in different properties of these films and they are most suited for certain applications.

The growth methods presented in this research are oblique angled sputtering with localized magnetic field and oblique sputtering without presence of magnetic field. The uniaxial anisotropy can be controlled by changing the angle during sputtering. The resulting film of CZTB is tested for magnetic anisotropy and soft magnetism at room temperature by using Lakeshore 7500 Vibrating Sample Magnetometer. The results are presented, analyzed and explained using characterization techniques. Future work includes magnetic field presence during deposition, magnetic devices of this film with giga hertz range operating frequencies.

The recent flurry of security breaches have raised serious concerns about the security of data communication and storage. A promising way to enhance the security of the system is through physical root of trust, such as, through use of physical unclonable functions (PUF). PUF leverages the inherent randomness in physical systems to provide device specific authentication and encryption.

In this thesis, first the design of a highly reliable resistive random access memory (RRAM) PUF is presented. Compared to existing 1 cell/bit RRAM, here the sum of the read-out currents of multiple RRAM cells are used for generating one response bit. This method statistically minimizes any early-lifetime failure due to RRAM retention degradation at high temperature or under voltage stress. Using a device model that was calibrated using IMEC HfOx RRAM experimental data, it was shown that an 8 cells/bit architecture achieves 99.9999% reliability for a lifetime >10 years at 125℃ . Also, the hardware area overhead of the proposed 8 cells/bit RRAM PUF architecture was smaller than 1 cell/bit RRAM PUF that requires error correction coding to achieve the same reliability.

Next, a basic security primitive is presented, where the RRAM PUF is embedded in the cryptographic module, SHA-256. This architecture is referred to as Embedded PUF or EPUF. EPUF has a security advantage over SHA-256 as it never exposes the PUF response to the outside world. Instead, in each round, the PUF response is used to change a few bits of the message word to produce a unique message digest for each IC. The use of EPUF as a key generation module for AES is also shown. The hardware area requirement for SHA-256 and AES-128 is then analyzed using synthesis results based on TSMC 65nm library. It is shown that the area overhead of 8 cells/bit RRAM PUF is only 1.08% of the SHA-256 module and 0.04% of the AES-128 module. The security analysis of the PUF based systems is also presented. It is shown that the EPUF-based systems are resistant towards standard attacks on PUFs, and that the security of the cryptographic modules is not compromised.

The aging process due to Bias Temperature Instability (both NBTI and PBTI) and Channel Hot Carrier (CHC) is a key limiting factor of circuit lifetime in CMOS design. Threshold voltage shift due to BTI is a strong function of stress voltage and temperature complicating stress and recovery prediction. This poses a unique challenge for long-term aging prediction for wide range of stress patterns. Traditional approaches usually resort to an average stress waveform to simplify the lifetime prediction. They are efficient, but fail to capture circuit operation, especially under dynamic voltage scaling (DVS) or in analog/mixed signal designs where the stress waveform is much more random. This work presents a suite of modelling solutions for BTI that enable aging simulation under all possible stress conditions. Key features of this work are compact models to predict BTI aging based on Reaction-Diffusion theory when the stress voltage is varying. The results to both reaction-diffusion (RD) and trapping-detrapping (TD) mechanisms are presented to cover underlying physics. Silicon validation of these models is performed at 28nm, 45nm and 65nm technology nodes, at both device and circuit levels. Efficient simulation leveraging the BTI models under DVS and random input waveform is applied to both digital and analog representative circuits such as ring oscillators and LNA. Both physical mechanisms are combined into a unified model which improves prediction accuracy at 45nm and 65nm nodes. Critical failure condition is also illustrated based on NBTI and PBTI at 28nm. A comprehensive picture for duty cycle shift is shown. DC stress under clock gating schemes results in monotonic shift in duty cycle which an AC stress causes duty cycle to converge close to 50% value. Proposed work provides a general and comprehensive solution to aging analysis under random stress patterns under BTI.

Channel hot carrier (CHC) is another dominant degradation mechanism which affects analog and mixed signal circuits (AMS) as transistor operates continuously in saturation condition. New model is proposed to account for e-e scattering in advanced technology nodes due to high gate electric field. The model is validated with 28nm and 65nm thick oxide data for different stress voltages. It demonstrates shift in worst case CHC condition to Vgs=Vds from Vgs=0.5Vds. A novel iteration based aging simulation framework for AMS designs is proposed which eliminates limitation for conventional reliability tools. This approach helps us identify a unique positive feedback mechanism termed as Bias Runaway. Bias runaway, is rapid increase of the bias voltage in AMS circuits which occurs when the feedback between the bias current and the effect of channel hot carrier turns into positive. The degradation of CHC is a gradual process but under specific circumstances, the degradation rate can be dramatically accelerated. Such a catastrophic phenomenon is highly sensitive to the initial operation condition, as well as transistor gate length. Based on 65nm silicon data, our work investigates the critical condition that triggers bias runaway, and the impact of gate length tuning. We develop new compact models as well as the simulation methodology for circuit diagnosis, and propose design solutions and the trade-offs to avoid bias runaway, which is vitally important to reliable AMS designs.

The advent of threshold logic simplifies the traditional Boolean logic to the single level multi-input function. Threshold logic latch (TLL), among implementations of threshold logic, is functionally equivalent to a multi-input function with an edge triggered flip-flop, which stands out to improve area and both dynamic and leakage power consumption, providing an appropriate design alternative. Accordingly, the TLL standard cell library is designed. Through technology mapping, hybrid circuit is generated by absorbing the logic cone backward from each flip-flip to get the smallest remaining feeder. With the scan test methodology adopted, design for testability (DFT) is proposed, including scan element design and scan chain insertion. Test synthesis flow is then introduced, according to the Cadence tool, RTL compiler. Test application is the process of applying vectors and the response analysis, which is mainly about the testbench design. A parameterized generic self-checking Verilog testbench is designed for static fault detection. Test development refers to the fault modeling, and test generation. Firstly, functional truth table test generation on TLL cells is proposed. Before the truth table test of the threshold function, the dependence of sequence of vectors applied, i.e., the dependence of current state on the previous state, should be eliminated. Transition test (dynamic pattern) on all weak inputs is proved to be able to test the reset function, which is supposed to erase the history in the reset phase before every evaluation phase. Remaining vectors in the truth table except the weak inputs are then applied statically (static pattern). Secondly, dynamic patterns for all weak inputs are proposed to detect structural transistor level faults analyzed in the TLL cell, with single fault assumption and stuck-at faults, stuck-on faults, and stuck-open faults under consideration. Containing those patterns, the functional test covers all testable structural faults inside the TLL. Thirdly, with the scope of the whole hybrid netlist, the procedure of test generation is proposed with three steps: scan chain test; test of feeders and other scan elements except TLLs; functional pattern test of TLL cells. Implementation of this procedure is discussed in the automatic test pattern generation (ATPG) chapter.