This thesis project explains what thermal interface materials (TIMs) are, what they are used for, and how to measure their properties. Thermal interface materials are typically either a grease like paste or a soft polymer pad that is placed between two solids to increase the heat transfer rate. Solids in contact with each other experience a very large thermal contact resistance, this creates a thermal bottleneck which severely decreases the heat transfer from one solid to another. To solve this, particles with a high thermal conductivity are used as filler material in either a grease or polymer. A common application for TIMs is in computer components, where a TIM is used to remove the heat generated from computer chips. These materials allow for computer chips to run faster without overheating or throttling performance. However, further improvements to TIMs are still desired, which are needed for more powerful computer chips. In this work, a Stepped Bar Apparatus (SBA) is used to evaluate the thermal properties of TIMs. The SBA is based on Fourier’s Law of one-dimensional heat transfer. This work explains the fundamentals of the SBA measurement, and develops a reliable way to confirm the SBA’s measurement consistency through the use of reference samples. Furthermore, this work evaluates the effects of volume fraction and magnetic alignment on the performance of nickel flakes mixed into a polymer to create a soft TIM composite pad. Magnets are used to align the nickel flakes into a column like arrangement in the direction that heat will travel. Magnetic alignment increases the thermal conductivity of the composite pads, and has peak performance at low compression.