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Many of the advanced integrated circuits in the past used monolithic grade die due to power, performance and cost considerations. Today, heterogenous integration of multiple dies into a single package is possible because of the advancement in packaging. These heterogeneous

Many of the advanced integrated circuits in the past used monolithic grade die due to power, performance and cost considerations. Today, heterogenous integration of multiple dies into a single package is possible because of the advancement in packaging. These heterogeneous multi-chiplet systems provide high performance at minimum fabrication cost. The main challenge is to interconnect these chiplets while keeping the power and performance closer to monolithic grade. Intel’s Advanced Interface Bus (AIB) is a short reach interface that offers high bandwidth, power efficient, low latency, and cost effective on-package connectivity between chiplets. It supports flexible interconnection of the chiplets with high speed data transfer. Specifically, it is a die to die parallel interface implemented with multiple configurable channels, routed between micro-bumps. In this work, the AIB model is synthesized in 65nm technology node and a performancemodel is generated. This model generates area, power and latency results for multiple technology nodes using technology scaling methods. For all nodes, the area, power and latency values increase linearly with frequency and number of channels. The bandwidth also increases linearly with the number of input/output lanes, which is a function of the micro-bump pitch. Next, the AIB performance model is integrated with the benchmarking simulator, Scalable In-Memory Acceleration With Mesh (SIAM), to realize a scalable chipletbased end-to-end system. The Ground-Referenced Signaling (GRS) driver model in SIAM is replaced with the AIB model and an end-to-end evaluation of Deep Neural Network (DNN) performance is carried out for two contemporary DNN models. Comparative analysis between SIAM with GRS and SIAM with AIB show that while the area of AIB transmitter is less compared to GRS transmitter, the AIB transmitter offers higher bandwidth than GRS transmitter at the expense of higher energy. Furthermore, SIAM with AIB provides more realistic timing numbers since the NoP driver latency is also taken into consideration.
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    Title
    • Modeling of Intel’s Advanced Interface Bus and its Evaluation on a Chiplet-based System
    Contributors
    Date Created
    2022
    Resource Type
  • Text
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    Note
    • Partial requirement for: M.S., Arizona State University, 2022
    • Field of study: Electrical Engineering

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