Metallization to Silicon Solar Cells: Improving Optothermal Performance of PERC and Developing New Systems for TOPCon and SHJ

Metallization of solar cells is a critical process step in the manufacturing of silicon photovoltaics (PV) as it plays a large role in device performance and production cost. Improvements in device performance linked to metallization and reduction in material usage and processing costs will continue to drive next-generation silicon PV technology. Chapter 1 introduces the context for the contributions of this thesis by providing background information on silicon PV cell technology, solar cell device physics and characterization, and metallization performance for common silicon cell structures. Chapter 2 presents a thermal model that links sub-bandgap reflectance, an important metric at the rear metal interface, to outdoor module operating temperature. Chapter 3 implements this model experimentally with aluminum back-surface field (Al-BSF), passivated emitter and rear contact (PERC), and passivated emitter rear totally diffused (PERT) mini-modules, where the PERT cells were modified to include an optimized sub-bandgap reflector stack. The dedicated optical layer was a porous low-refractive index silica nanoparticle film and was deposited between the dielectric passivation and full area metallization. This created an appreciable boost in sub-bandgap reflectance over the PERC and Al-BSF cells, which directly lead to cooler operating temperature of the fielded module. Chapter 4 investigates low-temperature Ag metallization approaches to SiO2/polysilicon passivating contacts (TOPCon architecture). The low-temperature Ag sintering process does not damage TOPCon passivation for structures with 40-nm-thick poly-Si but shows higher contact resistivity than sputtered references. This disparity is investigated and the impact of Ag diffusion processes, microstructure changes, ambient gases, and interfacial chemical reactions are evaluated. Chapter 5 investigates sputtered Al metallization to silicon heterojunction contacts of both polarities. This In-free and Ag-free metallization process can achieve low contact resistivity and no passivation loss when annealed between 150-180 °C. The passivation degradation at higher temperatures was studied with high-resolution microscopy and elemental mapping, where the interdiffusion processes were identified. Lastly, Chapter 6 summarizes the contribution of this work.