RPCVD Growth of Epitaxial Si-Ge-Sn Alloys for Optoelectronics Applications

Ge1-xSnx and SiyGe1-x-ySnx materials are being researched intensively for applications in infra-red optoelectronic devices. Due to their direct band gap these materials may in-fact be the enabling factor in the commercial realization of silicon photonics/group IV photonics and the integration of nanophotonics with nanoelectronics. However the synthesis of these meta-stable semiconductor alloys, with a range of Sn-compositions, remains the primary technical challenge. Highly specialized epitaxial growth methods must be employed to produce single crystal layers which have sufficient quality for optoelectronic device applications. Up to this point these methods have been unfavorable from a semiconductor manufacturing perspective. In this work the growth of high-quality Si-Ge-Sn epitaxial alloys on Ge-buffered Si (100) using an industry-standard reduced pressure chemical vapor deposition reactor and a cost-effective chemistry is demonstrated. The growth kinetics are studied in detail in-order to understand the factors influencing layer composition, morphology, and defectivity. In doing so breakthrough GeSn materials and device results are achieved including methods to overcome the limits of Sn-incorporation and the realization of low-defect and strain-relaxed epitaxial layers with up to 20% Sn.

P and n-type doping methods are presented in addition to the production of SiGeSn ternary alloys. Finally optically stimulated lasing in thick GeSn layers and SiGeSn/GeSn multiple quantum wells is demonstrated. Lasing wavelengths ranging from 2-3 µm at temperatures up to 180K are realized in thick layers. Whereas SiGeSn/GeSn multiple quantum wells on a strain-relaxed GeSn buffers have enabled the first reported SiGeSn/GeSn multiple quantum well laser operating up to 80K with threshold power densities as low as 33 kW/cm2.