156425-Thumbnail Image.png
Description
With the high demand for faster and smaller wireless communication devices, manufacturers have been pushed to explore new materials for smaller and faster transistors. One promising class of transistors is high electron mobility transistors (HEMT). AlGaAs/GaAs HEMTs have been shown

With the high demand for faster and smaller wireless communication devices, manufacturers have been pushed to explore new materials for smaller and faster transistors. One promising class of transistors is high electron mobility transistors (HEMT). AlGaAs/GaAs HEMTs have been shown to perform well at high power and high frequencies. However, AlGaN/GaN HEMTs have been gaining more attention recently due to their comparatively higher power densities and better high frequency performance. Nevertheless, these devices have experienced truncated lifetimes. It is assumed that reducing defect densities in these materials will enable a more direct study of the failure mechanisms in these devices. In this work we present studies done to reduce interfacial oxygen at N-polar GaN/GaN interfaces, growth conditions for InAlN barrier layer, and microanalysis of a partial InAlN-based HEMT. Additionally, the depth of oxidation of an InAlN layer on a gate-less InAlN/GaN metal oxide semiconductor HEMT (MOSHEMT) was investigated. Measurements of electric fields in AlGaN/GaN HEMTs with and without field plates are also presented.
Reuse Permissions


  • Download restricted.

    Details

    Title
    • Investigation of Gallium Nitride Heterostructures for Application to High Electron Mobility Transistors
    Contributors
    Date Created
    2018
    Resource Type
  • Text
  • Collections this item is in
    Note
    • thesis
      Partial requirement for: Ph.D., Arizona State University, 2018
    • bibliography
      Includes bibliographical references (pages 102-109)
    • Field of study: Physics

    Citation and reuse

    Statement of Responsibility

    by Thomas O. McConkie

    Machine-readable links