Full metadata
Title
High speed CMOS image sensor
Description
High speed image sensors are used as a diagnostic tool to analyze high speed processes for industrial, automotive, defense and biomedical application. The high fame rate of these sensors, capture a series of images that enables the viewer to understand and analyze the high speed phenomena. However, the pixel readout circuits designed for these sensors with a high frame rate (100fps to 1 Mfps) have a very low fill factor which are less than 58%. For high speed operation, the exposure time is less and (or) the light intensity incident on the image sensor is less. This makes it difficult for the sensor to detect faint light signals and gives a lower limit on the signal levels being detected by the sensor. Moreover, the leakage paths in the pixel readout circuit also sets a limit on the signal level being detected. Therefore, the fill factor of the pixel should be maximized and the leakage currents in the readout circuits should be minimized.
This thesis work presents the design of the pixel readout circuit suitable for high speed and low light imaging application. The circuit is an improvement to the 6T pixel readout architecture. The designed readout circuit minimizes the leakage currents in the circuit and detects light producing a signal level of 350µV at the cathode of the photodiode. A novel layout technique is used for the pixel, which improves the fill factor of the pixel to 64.625%. The read out circuit designed is an integral part of high speed image sensor, which is fabricated using a 0.18 µm CMOS technology with the die size of 3.1mm x 3.4 mm, the pixel size of 20µm x 20 µm, number of pixel of 96 x 96 and four 10-bit pipelined ADC’s. The image sensor achieves a high frame rate of 10508 fps and readout speed of 96 M pixels / sec.
This thesis work presents the design of the pixel readout circuit suitable for high speed and low light imaging application. The circuit is an improvement to the 6T pixel readout architecture. The designed readout circuit minimizes the leakage currents in the circuit and detects light producing a signal level of 350µV at the cathode of the photodiode. A novel layout technique is used for the pixel, which improves the fill factor of the pixel to 64.625%. The read out circuit designed is an integral part of high speed image sensor, which is fabricated using a 0.18 µm CMOS technology with the die size of 3.1mm x 3.4 mm, the pixel size of 20µm x 20 µm, number of pixel of 96 x 96 and four 10-bit pipelined ADC’s. The image sensor achieves a high frame rate of 10508 fps and readout speed of 96 M pixels / sec.
Date Created
2016
Contributors
- Zol, Akshay (Author)
- Barnaby, Hugh J (Thesis advisor)
- Mikkola, Esko O (Committee member)
- Kitchen, Jennifer N (Committee member)
- Arizona State University (Publisher)
Topical Subject
Resource Type
Extent
xi, 70 pages : illustrations (some color)
Language
eng
Copyright Statement
In Copyright
Primary Member of
Peer-reviewed
No
Open Access
No
Handle
https://hdl.handle.net/2286/R.I.40301
Statement of Responsibility
by Akshay Zol
Description Source
Viewed on November 28, 2016
Level of coding
full
Note
thesis
Partial requirement for: M.S., Arizona State University, 2016
bibliography
Includes bibliographical references (pages 67-70)
Field of study: Electrical engineering
System Created
- 2016-10-12 02:20:16
System Modified
- 2021-08-30 01:21:17
- 3 years 2 months ago
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