Full metadata
Title
Needleless electrospinning experimental study and nanofiber application in semiconductor packaging
Description
ABSTRACT Electronics especially mobile electronics such as smart phones, tablet PCs, notebooks and digital cameras are undergoing rapid development nowadays and have thoroughly changed our lives. With the requirement of more transistors, higher power, smaller size, lighter weight and even bendability, thermal management of these devices became one of the key challenges. Compared to active heat management system, heat pipe, which is a passive fluidic system, is considered promising to solve this problem. However, traditional heat pipes have size, weight and capillary limitation. Thus new type of heat pipe with smaller size, lighter weight and higher capillary pressure is needed. Nanofiber has been proved with superior properties and has been applied in multiple areas. This study discussed the possibility of applying nanofiber in heat pipe as new wick structure. In this study, a needleless electrospinning device with high productivity rate was built onsite to systematically investigate the effect of processing parameters on fiber properties as well as to generate nanofiber mat to evaluate its capability in electronics cooling. Polyethylene oxide (PEO) and Polyvinyl Alcohol (PVA) nanofibers were generated. Tensiometer was used for wettability measurement. The results show that independent parameters including spinneret type, working distance, solution concentration and polymer type are strongly correlated with fiber morphology compared to other parameters. The results also show that the fabricated nanofiber mat has high capillary pressure.
Date Created
2014
Contributors
- Sun, Tianwei (Author)
- Jiang, Hanqing (Thesis advisor)
- Yu, Hongyu (Committee member)
- Chen, Kangping (Committee member)
- Arizona State University (Publisher)
Topical Subject
Resource Type
Extent
vi, 56 p. : ill. (some col.)
Language
eng
Copyright Statement
In Copyright
Primary Member of
Peer-reviewed
No
Open Access
No
Handle
https://hdl.handle.net/2286/R.I.24815
Statement of Responsibility
by Tianwei Sun
Description Source
Viewed on July 1, 2014
Level of coding
full
Note
thesis
Partial requirement for: M.S., Arizona State University, 2014
bibliography
Includes bibliographical references (p. 53-56)
Field of study: Mechanical engineering
System Created
- 2014-06-09 02:07:24
System Modified
- 2021-08-30 01:35:57
- 3 years 2 months ago
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