Finite Element Analysis of Microstructural Weak and Strong Links for Shock-Induced Damage in Metallic Materials

Understanding damage evolution, particularly as it relates to local nucleation and growth kinetics of spall failure in metallic materials subjected to shock loading, is critical to national security. This work uses computational modeling to elucidate what characteristics have the highest impact on damage localization at the microstructural level in metallic materials, since knowledge of these characteristics is critical to improve these materials. The numerical framework consists of a user-defined material model implemented in a user subroutine run in ABAQUS/Explicit that takes into account crystal plasticity, grain boundary effects, void nucleation and initial growth, and both isotropic and kinematic hardening to model incipient spall. Finite element simulations were performed on copper bicrystal models to isolate the boundary effects between two grains. Two types of simulations were performed in this work: experimentally verified cases in order to validate the constitutive model as well as idealized cases in an attempt to determine the microstructural characteristic that define weakest links in terms of spall damage. Grain boundary effects on damage localization were studied by varying grain boundary orientation in respect to the shock direction and the crystallographic properties of each grain in the bicrystal. Varying these parameters resulted in a mismatch in Taylor factor across the grain boundary and along the shock direction. The experimentally verified cases are models of specific damage sites found from flyer plate impact tests on copper multicrystals in which the Taylor factor mismatch across the grain boundary and along the shock direction are both high or both low. For the idealized cases, grain boundary orientation and crystallography of the grains are chosen such that the Taylor factor mismatch in the grain boundary normal and along the shock direction are maximized or minimized. A perpendicular grain boundary orientation in respect to the shock direction maximizes Taylor factor mismatch, while a parallel grain boundary minimizes the mismatch. Furthermore, it is known that <1 1 1> crystals have the highest Taylor factor, while <0 0 1> has nearly the lowest Taylor factor. The permutation of these extremes for mismatch in the grain boundary normal and along the shock direction results in four idealized cases that were studied for this work. Results of the simulations demonstrate that the material model is capable of predicting damage localization, as it has been able to reproduce damage sites found experimentally. However, these results are qualitative since further calibration is still required to produce quantitatively accurate results. Moreover, comparisons of results for void nucleation rate and void growth rate suggests that void nucleation is more influential in the total void volume fraction for bicrystals with high property mismatch across the interface, suggesting that nucleation is the dominant characteristic in the propagation of damage in the material. Further work in recalibrating the simulation parameters and modeling different bicrystal orientations must be done to verify these results.